ADHESIVE RESIN COMPOSITION

• Main Authors: SUMIDA KATSUHIKO, YANO NORIYASU
• Format: Patent
• Language: English
• Published: 10.01.2008
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive resin composition improving bondability between a layer constituted from a cycloolefin resin and a layer constituted from another thermoplastic resin. SOLUTION: The adhesive resin composition is one for bonding a layer constituted from a cycloolefin resin to a layer constituted from another thermoplastic resin and comprises a tackifying component (A) in which the melting initiation temperature in an endothermogram (second heating) as determined with a differential scanning calorimeter (DSC) at a temperature rise rate of 20°C/min appears in the range of -20 to +50°C and the melting finish temperature in the endothermogram appears in the range of 70 to 100°C and a polyolefin resin (B) in which the half-width value of the melting peak in the endothermogram is 20°C or below. COPYRIGHT: (C)2008,JPO&INPIT