METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a technology for preventing adhesion of resin at an undesirable position during the molding step, in the fabrication process of a semiconductor device. SOLUTION: Clearance between the parent body 1 of a substrate and a pot holder is eliminated by making a guide pin 8...

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Bibliographic Details
Main Authors SHIMIZU FUKUMI, KURATOMI BUNJI, NISHIDA TAKAFUMI
Format Patent
LanguageEnglish
Published 27.12.2007
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PROBLEM TO BE SOLVED: To provide a technology for preventing adhesion of resin at an undesirable position during the molding step, in the fabrication process of a semiconductor device. SOLUTION: Clearance between the parent body 1 of a substrate and a pot holder is eliminated by making a guide pin 8A7 raised from below a guide hole GH, and sliding the guide hole GH to copy the inclined surface IS of the guide pin 8A7 formed by forward tapering, thereby sliding the parent body 1 of a substrate on a lower cavity base toward the pot holder. Molding step is performed under the situation where the gap no longer exists. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060162094