SPIRAL CPU HEAT SINK
PROBLEM TO BE SOLVED: To achieve high cooling efficiency inexpensively by solving the problem that, since the heating value of a CPU is recently increased, and a cooling device with much higher cooling efficiency is required for cooling the CPU, it is difficult to say that a water-cooled mechanism o...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
20.12.2007
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| Subjects | |
| Online Access | Get full text |
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| Abstract | PROBLEM TO BE SOLVED: To achieve high cooling efficiency inexpensively by solving the problem that, since the heating value of a CPU is recently increased, and a cooling device with much higher cooling efficiency is required for cooling the CPU, it is difficult to say that a water-cooled mechanism or liquefied gas whose cooling efficiency is high is easy to handle in terms of maintenance performance, cost performance, and its affinity with a current system. SOLUTION: A cylindrical body is formed as a core 5, a heat radiating fin 2 is spirally formed, and the outer periphery of the spiral traveling direction is covered with any thing so that an air duct board 6 can be configured. COPYRIGHT: (C)2008,JPO&INPIT |
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| AbstractList | PROBLEM TO BE SOLVED: To achieve high cooling efficiency inexpensively by solving the problem that, since the heating value of a CPU is recently increased, and a cooling device with much higher cooling efficiency is required for cooling the CPU, it is difficult to say that a water-cooled mechanism or liquefied gas whose cooling efficiency is high is easy to handle in terms of maintenance performance, cost performance, and its affinity with a current system. SOLUTION: A cylindrical body is formed as a core 5, a heat radiating fin 2 is spirally formed, and the outer periphery of the spiral traveling direction is covered with any thing so that an air duct board 6 can be configured. COPYRIGHT: (C)2008,JPO&INPIT |
| Author | HATAKEYAMA TATSUO |
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| Snippet | PROBLEM TO BE SOLVED: To achieve high cooling efficiency inexpensively by solving the problem that, since the heating value of a CPU is recently increased, and... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SPIRAL CPU HEAT SINK |
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