SPIRAL CPU HEAT SINK

PROBLEM TO BE SOLVED: To achieve high cooling efficiency inexpensively by solving the problem that, since the heating value of a CPU is recently increased, and a cooling device with much higher cooling efficiency is required for cooling the CPU, it is difficult to say that a water-cooled mechanism o...

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Bibliographic Details
Main Author HATAKEYAMA TATSUO
Format Patent
LanguageEnglish
Published 20.12.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To achieve high cooling efficiency inexpensively by solving the problem that, since the heating value of a CPU is recently increased, and a cooling device with much higher cooling efficiency is required for cooling the CPU, it is difficult to say that a water-cooled mechanism or liquefied gas whose cooling efficiency is high is easy to handle in terms of maintenance performance, cost performance, and its affinity with a current system. SOLUTION: A cylindrical body is formed as a core 5, a heat radiating fin 2 is spirally formed, and the outer periphery of the spiral traveling direction is covered with any thing so that an air duct board 6 can be configured. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060184923