EPOXY RESIN COMPOSITION AND PREPREG USING THE RESIN COMPOSITION

• Main Authors: MATSUIDE DAISUKE, KIMURA YASUYUKI
• Format: Patent
• Language: English
• Published: 20.12.2007
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide an epoxy resin composition without causing dusting from prepreg to be a factor in production of dust in the prepreg employed for a flexible printed wiring board used in electronic equipment with ultrasmall flow of a resin adversely affecting the flexibility, having excellent adhesiveness to a polyimide and copper and solder heat resistance and achieving flame retardation with a non-halogen compound and to provide the prepreg. SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent, a flame retardant and a curing accelerator. The epoxy resin composition comprises (a) a phosphorus-containing epoxy resin, (b) a liquid rubber which has an epoxy group and is a liquid at 20°C and (c) an epoxy resin having ≥100 to <160°C softening point as the epoxy resin, (d) a phenol resin and (e) dicyandiamide as the curing agent and (f) a nitrogen-containing organophosphorus compound as a principal component as the flame retardant. The prepreg is obtained by using the epoxy resin composition. COPYRIGHT: (C)2008,JPO&INPIT