SEMICONDUCTOR PACKAGE

• Main Authors: HIROSE YUKIE, IWASHIMA MAKOTO, HIROTA MASAKI, FUKUYAMA YASUHIRO, OTA YOSHIMI
• Format: Patent
• Language: English
• Published: 13.12.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor package which can increase getter amount without enlarging a package size. SOLUTION: An infrared sensor 1 includes an element substrate 2, a lid substrate 3, and a getter substrate 4. An infrared detection element 5 is formed on the surface of the element substrate 2. Protruding electrodes 6 are provided to the formation surface of the element substrate 2. Recesses 2a are formed on the opposite side surface of the formation surface of the element substrate 2. The lid substrate 3 is provided with through-electrodes 7 which take out signals output from the protruded electrodes 6 of the infrared detection element 5 to the outside. The through-electrodes 7 are extended through the lid substrate 3 to the outer surface thereof, and connected to the protruded electrodes 6 mechanically and electrically. A recess 4a for mounting the element substrate 2 is formed in the getter substrate 4. Protrusions 4b are formed on a bottom surface of the recess 4a to engage with the recesses 2a of the element substrate 2. Further, a getter 8 is provided to the bottom surface of the recess 4a except the protrusions 4b. COPYRIGHT: (C)2008,JPO&INPIT