LASER BEAM CUTTING DEVICE AND LASER BEAM CUTTING METHOD

• Main Authors: YANO KOZABURO, KIDO MASAMI
• Format: Patent
• Language: English
• Published: 13.12.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GLASS; MACHINE TOOLS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To provide a laser beam cutting device capable of ensuring the high working efficiency, and preventing breakage of a product during the cutting work. SOLUTION: The laser beam cutting device 1 is used for separating a brittle plate 50 to be worked into a product and a remaining peripheral material, and comprises a placement stand 20 including a placement part for placing a product area of the brittle plate 50 becoming a product after the cutting, laser beam cutting mechanisms 11-15 for separating a remaining peripheral material area of the brittle plate 50 becoming the remaining peripheral material after the cutting from the product area of the brittle plate 50 by irradiating a cutting-scheduled area of the brittle plate 50 placed on the placement part with laser beams, and remaining peripheral material collecting mechanisms 16-18 which are located below the loading stand 20 and collect a remaining peripheral material 52 separated and dropped from the product area of the brittle plate 50 by the laser beam cutting mechanisms 11-15. COPYRIGHT: (C)2008,JPO&INPIT