SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC EQUIPMENT HAVING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability by devising a shape of a contact electrode. SOLUTION: In order to connect an external circuit represented by a semiconductor device and an antenna having an integrated circuit formed therein, the shape of a contact elect...

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Bibliographic Details
Main Authors AOKI TOMOYUKI, YAMADA HIROMI
Format Patent
LanguageEnglish
Published 06.12.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability by devising a shape of a contact electrode. SOLUTION: In order to connect an external circuit represented by a semiconductor device and an antenna having an integrated circuit formed therein, the shape of a contact electrode formed in the semiconductor device is devised, and the contact electrode hard to cause a contact failure between the external circuit and the contact electrode and having a high reliability is provided. A screen-printing method using a corner part-chamfered squeegee or a wedge-shaped squeegee is applied to forming the contact electrode. The contact electrode is largely classified into a peripheral part and a central part. The peripheral part has a tapered part in which a film thickness is gradually decreased from the central part to the end part, and the central part has a projection part of a shape continued from the tapered part. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070117903