SUBSTRATE ATTACHMENT STRUCTURE

PROBLEM TO BE SOLVED: To provide a substrate attachment structure where the result of joining on the side of lower surface of a substrate can be checked with ease. SOLUTION: The substrate attachment structure 10 is constituted such that, while a circuit board 13 which covers the opening of a concave...

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Bibliographic Details
Main Author OTSUBO TORU
Format Patent
LanguageEnglish
Published 06.12.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a substrate attachment structure where the result of joining on the side of lower surface of a substrate can be checked with ease. SOLUTION: The substrate attachment structure 10 is constituted such that, while a circuit board 13 which covers the opening of a concave portion 11a is mounted to a heat sink 11 where the concave portion 11a is formed so as to accommodate a MOSFET 12, the MOSFET 12 and the circuit board 13 are connected by a lead wire 14; and the heat sink 11 is covered with a lid 15 which covers the circuit board 13. A notch 13a is formed in an edge 13b around the portion to which the lead wire 14 of the circuit board 13 is connected, and the notch 13a is engaged with a protrusion 15d provided in the lid 15. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060143978