SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: OI TAKESHI, USUI OSAMU, OKA SEIJI
• Format: Patent
• Language: English
• Published: 29.11.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To obtain a manufacturing method for a semiconductor device excellent in heat radiating performance and capable of improving the reliability of the mounting thereof. SOLUTION: Semiconductor chips 7, 8 are placed on the exposed part 32a of a lead frame terminal 32, bonding porti...