SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To obtain a manufacturing method for a semiconductor device excellent in heat radiating performance and capable of improving the reliability of the mounting thereof. SOLUTION: Semiconductor chips 7, 8 are placed on the exposed part 32a of a lead frame terminal 32, bonding porti...

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Bibliographic Details
Main Authors OI TAKESHI, USUI OSAMU, OKA SEIJI
Format Patent
LanguageEnglish
Published 29.11.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To obtain a manufacturing method for a semiconductor device excellent in heat radiating performance and capable of improving the reliability of the mounting thereof. SOLUTION: Semiconductor chips 7, 8 are placed on the exposed part 32a of a lead frame terminal 32, bonding portions 22c, 23c and a bonding portion 24c are opposed to respective electrodes on the top face side of the chips via solder 10, and a lead frame terminal 25 is opposed to the extension 32c of the lead frame terminal 32 via the solder 10 and these are fixed together by a fixing jig. Then, after the solder 10 is fused by a reflow apparatus to bond and unify them together, they are sealed with resin, and a peripheral frame supporting the lead frame terminals 22-25 and a frame supporting the lead frame terminal 32 are cut away to obtain the semiconductor device. Since exposed parts 22a-24a, the lead frame terminal 25, and the exposed part 32a are exposed, a heat radiating area is large and the heat radiating performance is excellent, and the exposed parts 22a-24a and the lead frame terminal 25 to be connected externally are coplanar, so that the reliability of the mounting is improved. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060138472