BONDING MATERIAL

PROBLEM TO BE SOLVED: To provide a semiconductor device using a bonding material with a thick film which can ensure a good stress-relaxation property and a package height in a μBGA structure, and which achieves good chip lamination and wire bonding in stacked CSP. SOLUTION: The semiconductor device...

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Bibliographic Details
Main Authors HOSOKAWA YOICHI, KANEDA MAIKO, MASUNO MICHIO, MATSUZAKI TAKAYUKI
Format Patent
LanguageEnglish
Published 08.11.2007
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device using a bonding material with a thick film which can ensure a good stress-relaxation property and a package height in a μBGA structure, and which achieves good chip lamination and wire bonding in stacked CSP. SOLUTION: The semiconductor device has a structure in which at least two semiconductor chips 7, 9 are laminated on a semiconductor chip-mounting surface of a wiring board 5, and the semiconductor chips 7, 9 are bonded each other using a film form bonding material 1 having a thickness of 150 μm and more. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070121193