END SEALING MATERIAL

• Main Author: KUWABARA HARUYOSHI
• Format: Patent
• Language: English
• Published: 01.11.2007
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DYES; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide an end sealing material having excellent reliability for preventing mixing of water in the interior of a medium-/a large-sized panel of a liquid crystal, an organic EL (electroluminescent) display, etc. SOLUTION: The end sealing material comprises (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) a hygroscopic inorganic filler. (C) The inorganic filler has the surface treated with an un-reactive organosilicon compound and 0.01-0.3 μm average particle diameter. (D) The hygroscopic inorganic filler has ≥1 to <25 μm average particle diameter and ≥100 to ≤400 m2/g BET specific surface area and is contained in an amount of ≥20 to ≤65 mass% based on the whole components. COPYRIGHT: (C)2008,JPO&INPIT