PREPREG, METAL FOIL CLAD LAMINATED PLATE AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a printed wiring board that is halogen-free and gives a good hole shape in the processing by a carbon dioxide laser, and provide a prepreg and a metal foil clad laminated plate used as the materials therefor. SOLUTION: The prepreg is formed by impregnating or coating...

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Bibliographic Details
Main Author KOIZUMI KAORU
Format Patent
LanguageEnglish
Published 25.10.2007
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a printed wiring board that is halogen-free and gives a good hole shape in the processing by a carbon dioxide laser, and provide a prepreg and a metal foil clad laminated plate used as the materials therefor. SOLUTION: The prepreg is formed by impregnating or coating a substrate with a thermosetting resin composition which contains boehmite as an inorganic filler and does not contain a metal hydroxide other than boehmite and a halogenated compound, and drying it. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060103051