SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To enhance bonding strength of upper and lower interposers when each of a plurality of semiconductor chips is supported by the interposers. SOLUTION: The thermal expansion coefficient of a first package 10 is larger than that of a second package 30. The second package 30 is arr...

Full description

Saved in:
Bibliographic Details
Main Author AOYANAGI TETSUTOSHI
Format Patent
LanguageEnglish
Published 11.10.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To enhance bonding strength of upper and lower interposers when each of a plurality of semiconductor chips is supported by the interposers. SOLUTION: The thermal expansion coefficient of a first package 10 is larger than that of a second package 30. The second package 30 is arranged so that the second interposer 32 overlaps above a first semiconductor chip 16 and a first interposer 12. A contact 46 is provided between the first interposer 12 and a second interposer 32, so that a first end 47 connects to a first wiring pattern 14 and a second end 48 connects to a second wiring pattern 34. A reinforced part 50 is provided so as to expose part of the contact 46, and to cover the end 47 of the contact 46. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070182202