WAFER LEVEL PACKAGE STRUCTURE AND SENSOR DEVICE

• Main Authors: OKUTO TAKASHI, MIYAJIMA HISAKAZU, KATAOKA KAZUSHI, BABA TORU, GOTO KOJI, SAIJO TAKASHI
• Format: Patent
• Language: English
• Published: 11.10.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT; MEASURING; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a wafer level package structure capable of reducing the height of a sensor device including a package and preventing insulation breakdown of an IC part during manufacture, and to provide the sensor device. SOLUTION: The wafer level package structure includes: a sensor wafer 10 composed of a first semiconductor wafer on which a plurality of sensor bodies 1 provided with sensing parts and IC parts E2 cooperating with the sensing parts are formed; a first package wafer 20 composed of a second semiconductor wafer on which a through-hole wiring 24 electrically connected with the IC part E2 is formed for each of a plurality of the first package substrate parts 2 bonded to the sensor body 1 on one surface side of the sensor wafer 10; and a second package wafer 30 composed of a third semiconductor wafer including a plurality of second packaging substrate parts 3 bonded to the respective sensor bodies 1 on the other surface side of the sensor wafer 10. The sensor wafer 10 and each of the package wafers 20, 30 are bonded by wafer level. COPYRIGHT: (C)2008,JPO&INPIT