FLEXIBLE PRINTED BOARD AND ELECTRONIC COMPONENT MOUNTING CIRCUIT USING IT

PROBLEM TO BE SOLVED: To provide a flexible printed board capable of preventing an increase of contact resistance and a connection failure caused by a difference between thermal expansion coefficients of an electronic component and a flexible printed board, while maintaining the mounting density of...

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Bibliographic Details
Main Authors MISAKI NOBUMASA, NISHIMURA TATSUYA
Format Patent
LanguageEnglish
Published 27.09.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a flexible printed board capable of preventing an increase of contact resistance and a connection failure caused by a difference between thermal expansion coefficients of an electronic component and a flexible printed board, while maintaining the mounting density of the electronic component. SOLUTION: The flexible printed board 10 includes a base film 1; and a connection electrode 2 composed of copper foil, and formed on the surface of the electrode. The connection electrode 2 is connected with a terminal electrode 4 of an electronic component 3 via a solder. Around the connection electrode 2, a slit 6 is formed for thermal stress relaxation with a predetermined interval so as to sandwich the connection electrode 2. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060072085