ELECTROMAGNETIC WAVE-ABSORBING RESIN COMPOSITION AND FLEXIBLE PRINTED CIRCUIT BOARD

• Main Authors: WAKE HIDETARO, MARUNO SATOSHI, YAMADA KENSUKE
• Format: Patent
• Language: English
• Published: 16.08.2007
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide an electromagnetic wave-absorbing resin composition while maintaining bending property and heat resistance which are the great characteristics of a FPC (flexible printed circuit), capable of reducing unnecessary radiation noise. SOLUTION: This electromagnetic wave-absorbing resin composition is provided with that soft magnetic metal powder is dispersed in a siloxane-modified polyamic acid solution by 210 to 340 pts.wt. soft magnetic metal powder based on 100 pts.wt. resin solid portion of the modified polyamic acid solution. The soft magnetic metal powder consists of a Fe-based alloy containing at least 1 kind of element selected from a group consisting of Cr, Ni, Si, Al, Mo and Co. The soft magnetic metal powder has a flat form having preferably 3 to 80 μm mean particle diameter and ≤19 degree of flatness. COPYRIGHT: (C)2007,JPO&INPIT