SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of obtaining a high performance thin film transistor with little variation in characteristics in three-dimensional formation of a semiconductor device. SOLUTION: The manufacturing method of the semiconductor de...

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Bibliographic Details
Main Author HIROSHIMA YASUSHI
Format Patent
LanguageEnglish
Published 09.08.2007
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of obtaining a high performance thin film transistor with little variation in characteristics in three-dimensional formation of a semiconductor device. SOLUTION: The manufacturing method of the semiconductor device includes steps of forming a monocrystal or approximately monocrystal bottomed recess serving as a starting point in crystallization of a semiconductor film on a surface of a substrate; forming the semiconductor film on the substrate where the recess is formed; forming an approximately monocrystal grain having the starting point as an approximate center by heat treatment on the semiconductor film; patterning the semiconductor film; forming transistor regions to serve as a source/drain region and a channel formation region; and forming a gate insulation film and a gate electrode on the transistor regions to form the thin film transistor. In forming the transistor regions, at least the channel formation region is selected to be a region in the approximately monocrystal grain of the semiconductor film and not containing a direction in a crystal orientation of the substrate. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060017373