METHOD OF MANUFACTURING THERMOELEMENT AND THERMOELECTRIC MODULE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a low-cost thermoelement with low thermal conductivity and also without requiring a slicing process of a wafer and a dicing process of a thermoelement, and to provide a manufacturing method of a thermoelectric module using the thermoelement...

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Bibliographic Details
Main Authors YASUTAKE HIDETOSHI, HORIO YUUMA
Format Patent
LanguageEnglish
Published 02.08.2007
Subjects
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method of manufacturing a low-cost thermoelement with low thermal conductivity and also without requiring a slicing process of a wafer and a dicing process of a thermoelement, and to provide a manufacturing method of a thermoelectric module using the thermoelement manufactured by this method. SOLUTION: The thermoelement is manufactured by a manufacturing method; and comprises a process for installing a mold material 1 which has two or more through holes 2 on a cooling plate 30, a process for supplying molten metal 7 of thermoelectric material to the through holes 2 of the mold material 1, and a process for forming the thermoelement while solidifying the molten metal 7 of thermoelectric material by the through holes 2 of the mold material 1. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060011698