METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Author: TAKEBE YOSHIYUKI
• Format: Patent
• Language: English
• Published: 19.07.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device by which a semiconductor element or a substrate can be less bent and the semiconductor element can be less damaged when the semiconductor device is formed by bonding a semiconductor chip on a support member. SOLUTION: A semiconductor device 1 has a semiconductor element 2 bonded on a support member 4 with an adhesive sheet 3. The method for manufacturing the device comprises steps of placing the semiconductor element 2 on the support member 4 with the adhesive sheet 3 of a thermosetting composition disposed therebetween; semi-setting the adhesive sheet 3 in such a manner that the gel fraction of the adhesive sheet 3 becomes 20-70%, and then bonding the semiconductor element 2 on the support member 4; electrically connecting electrodes of the semiconductor element 2 to connections, after the step of semi-setting the adhesive sheet 3; and fully setting the adhesive sheet 3 made of a thermosetting composition, after the step of connecting the electrodes of the semiconductor element 2. COPYRIGHT: (C)2007,JPO&INPIT