MULTILAYERED ANISOTROPIC ELECTROCONDUCTIVE FILM

• Main Authors: HAN YONG SEOK, HAN CHUL JONG, PARK JEONG BEOM, MOON HYUK SOO, WOO SANG WOOK
• Format: Patent
• Language: English
• Published: 19.07.2007
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a multilayered anisotropic electroconductive film, which exhibits improved connection reliability, when members to be connected having electrodes facing each other are connected. SOLUTION: The multilayered anisotropic electroconductive film includes a non-electroconductive adhesive layer composed of a first insulation adhesive, an electroconductive adhesive layer which is laminated on one side of the non-electroconductive adhesive layer and composed of, as the substrate, a second insulation adhesive having a curing speed faster than that of the first insulation adhesive and contains electroconductive particles dispersed in it and a release film attached to the opposite side of the non-electroconductive adhesive layer contacting with the electroconductive adhesive layer. The damage of the electrodes of the members to be connected due to heat is prevented and the pressurization on the electroconductive particles is improved by using the multilayered anisotropic electroconductive film because of its faster curing speed. COPYRIGHT: (C)2007,JPO&INPIT