PRINTED WIRING BOARD, AND PROCESS FOR PRODUCING SAME

PROBLEM TO BE SOLVED: To form a solder film having good plane on the upper surface of a pattern for touching an electrode plate, while using lead-free solder in a step for flow soldering an electronic component to a printed wiring board. SOLUTION: The process for producing a printed wiring board 1 c...

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Bibliographic Details
Main Author HAYAKAWA MANABU
Format Patent
LanguageEnglish
Published 05.07.2007
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To form a solder film having good plane on the upper surface of a pattern for touching an electrode plate, while using lead-free solder in a step for flow soldering an electronic component to a printed wiring board. SOLUTION: The process for producing a printed wiring board 1 comprises a step for forming a wiring pattern on a substrate, and a step for applying resist onto the substrate. A plurality of elongated wavelike openings are formed in the resist film applied to the upper surface at the pattern portion of the wiring pattern, for touching an electrode plate during the step for applying resist. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050369674