METHOD OF REMOVING METALS IN SCRUBBER

PROBLEM TO BE SOLVED: To obtain a method to remove metallic contamination substance in substrate cleaning process. SOLUTION: The method includes adding citric acid solution into the liquid medium of a semiconductor substrate cleaning system. Hydrogen ion concentration pH of the liquid medium is adju...

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Bibliographic Details
Main Author KRUSELL WILBUR C
Format Patent
LanguageEnglish
Published 28.06.2007
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To obtain a method to remove metallic contamination substance in substrate cleaning process. SOLUTION: The method includes adding citric acid solution into the liquid medium of a semiconductor substrate cleaning system. Hydrogen ion concentration pH of the liquid medium is adjusted within a range from 6.5 to 14. Explanation for double-sided scrubber is given. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20070061530