METHOD AND KNIFE FOR OPENING SEMICONDUCTOR ELEMENT PACKAGE

PROBLEM TO BE SOLVED: To provide a method of opening a semiconductor element package which can open a semiconductor element package without damaging a semiconductor element. SOLUTION: In the semiconductor element package opening method, the semiconductor element package 20 in which an opening of a p...

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Bibliographic Details
Main Author SHIMONO OSAMU
Format Patent
LanguageEnglish
Published 21.06.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method of opening a semiconductor element package which can open a semiconductor element package without damaging a semiconductor element. SOLUTION: In the semiconductor element package opening method, the semiconductor element package 20 in which an opening of a package 23 housing a solid-state imaging element 22 in the inside is sealed with a transparent glass plate 21 using a sealer 24 is opened with a knife having an edge 11. The method has a heating process of heating the edge 11, and a peeling process of pushing the edge 11 heated in the heating process into a bonding portion between the package 23 and the transparent glass plate 21 to peel the transparent glass plate 21. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050355031