COMPONENT INCORPORATED SUBSTRATE, ELECTRONIC EQUIPMENT THEREWITH, AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a non-embedded component incorporated substrate capable of suppressing deformation of the shape of a via hole. SOLUTION: The component incorporated substrate 100 is constituted by incorporating an electronic component, and comprises a stacked body 55 of a plurality o...

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Bibliographic Details
Main Authors HAYASHI YOSHITAKE, YUHAKU SEI, OTANI KAZUO, UEDA YOJI, OKIMOTO RIKIYA
Format Patent
LanguageEnglish
Published 21.06.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a non-embedded component incorporated substrate capable of suppressing deformation of the shape of a via hole. SOLUTION: The component incorporated substrate 100 is constituted by incorporating an electronic component, and comprises a stacked body 55 of a plurality of wiring layers 10 (11, 12); and an opening 50 is formed in the stacked body 55. The electronic component 20 is mounted on the wiring layer 11 where the opening 50 is formed, and a frame body 30 is formed at the circumference of the opening 50. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050351677