SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To miniaturize a semiconductor device having a plurality of semiconductor chips. SOLUTION: The device has a wiring substrate 5, which has a major surface 5a and a rear 5b facing it and wherein a plurality of through-hole wirings 23 are formed, a plurality of memory chips 2 havi...

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Bibliographic Details
Main Authors NAITO TAKAHIRO, AKIBA TOSHIHIKO
Format Patent
LanguageEnglish
Published 14.06.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To miniaturize a semiconductor device having a plurality of semiconductor chips. SOLUTION: The device has a wiring substrate 5, which has a major surface 5a and a rear 5b facing it and wherein a plurality of through-hole wirings 23 are formed, a plurality of memory chips 2 having a memory circuit each, a microcomputer chip 3 having calculation processing functions, and a plurality of solder balls 6 provided to the rear 5b of the wiring substrate 5. A plurality of memory chips 2 are incorporated by being laminated in the wiring substrate 5. Consequently, the area required for chip mounting on the wiring substrate 5 can be reduced and an SIP (semiconductor device) 1 can be miniaturized. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050345410