ULTRASONIC BONDING EQUIPMENT, CONTROLLER THEREFOR, AND ULTRASONIC BONDING METHOD

• Main Authors: SUEMATSU MUTSUMI, AIZAWA TAKAHIRO, MARUYAMA TETSURO, OTANI KAZUMI, ISHIDA HIDENOBU, KITAZUMI HITOSHI
• Format: Patent
• Language: English
• Published: 07.06.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide ultrasonic bonding equipment which allows real time monitoring of the bonding states of all the joints, makes immediate detection of defects upon occurrence thereof, and thereby can be controlled to stop bonding operation or to do other operation when the defects are detected, and which also allows more accurate and surer detection of the ultrasonic vibrating state of a bonding tool, and also to provide a controller for the same. SOLUTION: The ultrasonic bonding equipment 1 comprises the bonding tool 4, an ultrasonic horn 3 which supports one end of the bonding tool 4 and applies ultrasonic vibration to the bonding tool 4, and a vibration measuring means for measuring the vibration of the bonding tool 4 to detect the positions of the nodes of the vibration of the bonding tool 4. The ultrasonic bonding equipment 1 is so controlled to continue or stop the bonding operation depending on the positions of the knots. COPYRIGHT: (C)2007,JPO&INPIT