CHAMFERING METHOD AND DEVICE FOR CIRCULAR HOLE

PROBLEM TO BE SOLVED: To provide a chamfering method and device for a circular hole, capable of prolonging the lifetime still longer without requiring frequent dressing operations. SOLUTION: According to the chamfering method for the circular hole, polishing is made with a whetstone which has a poli...

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Bibliographic Details
Main Authors KAMIKAWA KENJI, ONISHI YOSHIHIRO
Format Patent
LanguageEnglish
Published 07.06.2007
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a chamfering method and device for a circular hole, capable of prolonging the lifetime still longer without requiring frequent dressing operations. SOLUTION: According to the chamfering method for the circular hole, polishing is made with a whetstone which has a polishing surface 1b, consisting of a spherical surface or part thereof having a larger diameter than with that of the circular hole formed in a work and rotates about the whetstone axis that does not coincide to the center axis of the circular hole; and when polishing is conducted, the work and the whetstone axis 5 are rotated relatively under the condition of the polishing surface being in contact with the entire peripheral edge of the circular arc, and thereby chamfering of the peripheral edge 3a of the circular hole is conducted, in such an arrangement that the contacting part moves on the polishing surface at all times. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050335568