SUBCARRIER AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a subcarrier with a semiconductor element mounted thereon which is effectively prevented from being broken down by an external factor such as collision, has high yield and productivity, and accurately transmits a high frequency electric signal with low noise, and als...

Full description

Saved in:
Bibliographic Details
Main Author IDE NAOHITO
Format Patent
LanguageEnglish
Published 17.05.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a subcarrier with a semiconductor element mounted thereon which is effectively prevented from being broken down by an external factor such as collision, has high yield and productivity, and accurately transmits a high frequency electric signal with low noise, and also to provide a semiconductor device. SOLUTION: The subcarrier 1 comprises: an insulating base 13 substantially rectangular parallelepiped-shaped; a mounting part 14a formed on one side surface of the insulating base 13, with which a semiconductor element 2 is joined; wiring conductor layers 14b, 14c, formed from an upper surface of the insulating base 13 to the one side surface of the same; and L-shaped connecting fitments 15a, 15b joined so as to cover the wiring conductor layers 14b, 14c, from a portion of the wiring conductor layers 14b, 14c located on the upper surface of the insulating base 13 to a portion of the same located on the one side surface. In the subcarrier, an upper side principal surface of the portion of the connection fitments 15a, 15b located on the upper surface of the insulating base 13 is inclined with respect to the bottom surface of the insulating base 13. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050312319