SUCTION HEAD

PROBLEM TO BE SOLVED: To provide a suction head in which insulation at a part for suction-holding a semiconductor chip can be maintained over a long term. SOLUTION: The suction head comprises a head body 2 equipped with a nozzle fixing face 8, and a suction nozzle 3 equipped with a face 17 abutting...

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Bibliographic Details
Main Author TAKANO MITSUHIRO
Format Patent
LanguageEnglish
Published 17.05.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
MANIPULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a suction head in which insulation at a part for suction-holding a semiconductor chip can be maintained over a long term. SOLUTION: The suction head comprises a head body 2 equipped with a nozzle fixing face 8, and a suction nozzle 3 equipped with a face 17 abutting on the nozzle fixing face 8 and a face 19 abutting on a semiconductor chip when it is suction-held and formed of ceramic. A vacuum formation path 12 is provided in the head body 2 and one end of the vacuum formation path 12 is connected with an interconnection opening 13 provided in the nozzle fixing face 8. One end of the inner hole 20 of the suction nozzle 3 is connected with a suction opening 21 provided in the chip abutting face 19, and the other end is connected with a connection opening 22 provided in the head abutting face 17. The head 2 is connected with the suction nozzle 3 so that the interconnection opening 13 and the connection opening 22 are interconnected. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050311262