METHOD OF MOUNTING ELECTRONIC COMPONENTS AND APPARATUS THEREOF, AND METHOD OF CREATING ELECTRONIC COMPONENT MOUNTING DATA

• Main Authors: KURIBAYASHI TAKESHI, NAGAFUKU NOBUYASU, NISHIKAWA NOBORU
• Format: Patent
• Language: English
• Published: 26.04.2007
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: In mounting an electronic component using cream solder printing, this method has a determining process for determining the size of the self-alignment effect based on a state of positional deviation between the positions of lands corresponding to an electronic component to be mounted and the printing position of the cream solder corresponding to the lands. In the determining process, it is determined that the self-alignment effect is large when the cream solder is printed on a position deviated from the center of a land, and it is determined that the self-alignment effect is small if the cream solder is printed so as to overflow from the land. When the self-alignment effect is large, the target mounting position of the electronic component is set using the cream solder printing positions as a reference, and if the self-alignment effect is small, the target mounting position is set using the land positions as a reference. COPYRIGHT: (C)2007,JPO&INPIT