SUBSTRATE WITHOUT CORE LAYER AND ITS MANUFACTURING METHOD

• Main Author: CHO SOON-JIN
• Format: Patent
• Language: English
• Published: 26.04.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a substrate without a core layer with a signal transfer property improved due to the fact that an inner via-hole has become unnecessary, and to provide its manufacturing method. SOLUTION: The manufacturing method for the substrate without a core layer comprises (a) a step to form an insulating layer on the whole surface of a metallic sheet, (b) a step to form a via-hole on the insulating layer for interlayer electrical connection between the metallic sheet and other layer surface, and (c) a step to form many projected functional pads by etching the metallic sheet. The substrate without a core layer and its manufacturing method has a positive effect to improve the signal transfer property since the inner via-hole is unnecessary. COPYRIGHT: (C)2007,JPO&INPIT