SUBSTRATE WITHOUT CORE LAYER AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a substrate without a core layer with a signal transfer property improved due to the fact that an inner via-hole has become unnecessary, and to provide its manufacturing method. SOLUTION: The manufacturing method for the substrate without a core layer comprises (a) a...

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Bibliographic Details
Main Author CHO SOON-JIN
Format Patent
LanguageEnglish
Published 26.04.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a substrate without a core layer with a signal transfer property improved due to the fact that an inner via-hole has become unnecessary, and to provide its manufacturing method. SOLUTION: The manufacturing method for the substrate without a core layer comprises (a) a step to form an insulating layer on the whole surface of a metallic sheet, (b) a step to form a via-hole on the insulating layer for interlayer electrical connection between the metallic sheet and other layer surface, and (c) a step to form many projected functional pads by etching the metallic sheet. The substrate without a core layer and its manufacturing method has a positive effect to improve the signal transfer property since the inner via-hole is unnecessary. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060277249