LAMINATED PANEL AND WALL STRUCTURE USING THE LAMINATED PANEL

PROBLEM TO BE SOLVED: To provide a laminated panel superior not only in heat insulation performance but also in sound insulation performance. SOLUTION: This laminated panel is formed by laminatedly adhering a styrene resin foam body with a ratio of the bending elastic modulus to the bending strength...

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Bibliographic Details
Main Authors SUZUKI OSAMU, KOURA KOJI
Format Patent
LanguageEnglish
Published 26.04.2007
Subjects
BUILDING
CEILINGS
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
INSULATION OR OTHER PROTECTION OF BUILDINGS
ROOFS
WALLS, e.g. PARTITIONS
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Summary:PROBLEM TO BE SOLVED: To provide a laminated panel superior not only in heat insulation performance but also in sound insulation performance. SOLUTION: This laminated panel is formed by laminatedly adhering a styrene resin foam body with a ratio of the bending elastic modulus to the bending strength of 38 to 52 on a surface material formed of a gypsum board, a plywood, and so forth. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050298539