PLASMA PROCESSING APPARATUS AND METHOD, AND SEMICONDUCTOR MANUFACTURING APPARATUS

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and its method, which can be used for various processes, and can improve a plasma processing efficiency. SOLUTION: The plasma processing method provides a plurality of plasma sources of different types to one process chamber, and proceed...

Full description

Saved in:
Bibliographic Details
Main Authors HAHN SEOK-HYUN, PARK YOUNG-KYOU
Format Patent
LanguageEnglish
Published 19.04.2007
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and its method, which can be used for various processes, and can improve a plasma processing efficiency. SOLUTION: The plasma processing method provides a plurality of plasma sources of different types to one process chamber, and proceeds the process by changing the used plasma sources in the process progress. Since the type of the plasma source can be used as a process variable, the process efficiency can be further improved. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060272133