METHOD AND APPARATUS FOR FORMING RESIN SEALING OF ELECTRONIC COMPONENT

• Main Author: BANDO KAZUHIKO
• Format: Patent
• Language: English
• Published: 12.04.2007
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To prevent formation of resin burrs on the front surface of substrate by simplifying total structure of die to form a resin seal of electronic component loaded on the substrate, and by absorbing fluctuation in thickness of substrate at the time of forming the resin seal of electronic component. SOLUTION: The resin seal forming apparatus is constituted by forming a die 110 to form resin seal of electronic component from a first die 111 and a second die 112, and by laminating and allocating, to the die contact surface P, L of both dies, a die structure unit (die 110) of a plurality of units in which a substrate supplying part (substrate supplying set surface 113) is provided for supplying a single sheet of preliminary substrate 400 loading electronic component. Moreover, a die closing mechanism (press frame mechanism 130) is also arranged to simultaneously apply the die tightening pressure to the laminated by arranged die structure unit (die 110). COPYRIGHT: (C)2007,JPO&INPIT