LIGHT-EMITTING DEVICE

PROBLEM TO BE SOLVED: To provide a light-emitting device for obtaining desired light distribution characteristics and improving reliability. SOLUTION: The light-emitting device includes a reflector 40 for surrounding an LED chip 10; a lens 60 arranged while being overlapped to a sealing section 50 a...

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Bibliographic Details
Main Authors URANO YOJI, KAMATA SAKUO, NISHIOKA YASUSHI
Format Patent
LanguageEnglish
Published 05.04.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a light-emitting device for obtaining desired light distribution characteristics and improving reliability. SOLUTION: The light-emitting device includes a reflector 40 for surrounding an LED chip 10; a lens 60 arranged while being overlapped to a sealing section 50 and the reflector 40; and a dome-like color conversion member 70 arranged so that an air layer 80 is formed between the lens 60 and a light emission surface 60b. A submount member 30 for relaxing stress operating on the LED chip 10 caused by the difference in the coefficient of thermal expansion between the LED chip 10 and a metal plate 21 and thermally combining both of them is interposed between the LED chip 10 and the metal plate 21. The submount member 30 has a conductive pattern where respective electrodes at one surface side of the LED chip 10 are connected via bumps 13, 13 is provided, and each conductive pattern is connected to lead patterns 23, 23 provided on an insulating base material 22 in the packaging substrate 20 by bonding wires 14, 14. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050272851