LIGHT-EMITTING DEVICE

PROBLEM TO BE SOLVED: To provide a light-emitting device that has high heat radiation properties and is reliable, and has strong directivity of mixed color light. SOLUTION: The light-emitting device has a sealing section 50 for sealing an LED chip 10 and bonding wires 14, 14 at the packaging surface...

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Bibliographic Details
Main Authors URANO YOJI, KAMATA SAKUO, NISHIOKA YASUSHI
Format Patent
LanguageEnglish
Published 05.04.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a light-emitting device that has high heat radiation properties and is reliable, and has strong directivity of mixed color light. SOLUTION: The light-emitting device has a sealing section 50 for sealing an LED chip 10 and bonding wires 14, 14 at the packaging surface side of the LED chip 10 in a packaging substrate 20. A submount member 30 that relaxes stress operating on the LED chip 10 caused by the difference in the coefficient of linear expansion between the LED chip 10 and a metal plate 21 and thermally combines both of them is interposed between the LED chip 10 and the metal plate 21, an electrode at the submount member side in both the electrodes of the LED chip is connected to one bonding wire 14 via a conductive pattern provided at the submount member, and an electrode at a side opposite to the side of the submount member 30 is directly connected to the other bonding wire. The sealing section 50 is formed by a silicone resin, contains a yellow phosphor that is excited by light radiated from the LED chip 10 and radiates yellow-based light, and is formed in a concave lens shape. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050272839