COATING APPARATUS AND METHOD

• Main Authors: TAKASE SHINJI, KAJIMA ATSUO
• Format: Patent
• Language: English
• Published: 05.04.2007
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a coating apparatus capable of easily determining a parallel reference and a height reference of a slit nozzle and precisely performing a fine adjustment of a distance between a surface of a substrate and a lower end of the slit nozzle during coating. SOLUTION: The coating apparatus is provided in which reference jigs 6, 6 for determining a horizontal reference and a height reference of a slit nozzle 5 are mounted respectively on both ends of a substrate setting portion 3 in a width direction of a side surface of a coating starting position side, wherein the reference jig 6 includes a gauge head 8 capable of moving up and down, the gauge head 8 is biased upward by a spring or the like, the falling source of the gauge head 8 is set to a position so that an upper surface of the gauge head 8 is flush with an upper surface of the substrate setting portion 3, and the position is employed as a reference point in a height direction. COPYRIGHT: (C)2007,JPO&INPIT