SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method that ensures a high performance thin film transistor within a small variation of property in 3D semiconductor device formation. SOLUTION: This method comprises a concave formation process for forming a concave (123) serving...

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Bibliographic Details
Main Authors MIN HEE, HIROSHIMA YASUSHI, ISHIHARA RYOICHI
Format Patent
LanguageEnglish
Published 29.03.2007
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method that ensures a high performance thin film transistor within a small variation of property in 3D semiconductor device formation. SOLUTION: This method comprises a concave formation process for forming a concave (123) serving as a starting point in crystallizing a semiconductor film on a substrate (11) having a monocrystal or an approximate monocrystal at least at either side; a semiconductor film formation process for forming a semiconductor film (130) on the above substrate with the concave formed; a thermal treatment process for performing thermal treatment on the above semiconductor film; a thermal treatment process for forming an approximate monocrystal particle (13) where the above starting point is an approximate center, a patterning process for forming a transistor area (133) as a source area, drain area, and channel area by patterning the above semiconductor film; and a device formation process for forming a thin transistor by forming a gate insulating film (14) and a gate electrode (15) on the above transistor area. In the device formation process, a thin film transistor is formed in a direction different from that of the crystal face (111) of the monocrystal or approximate monocrystal of the above substrate. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050266063