INORGANIC MATERIAL WORKING METHOD

PROBLEM TO BE SOLVED: To provide an inorganic material working method and an inorganic material working device capable of working very fine and uniform deep grooves. SOLUTION: The inorganic material working method includes a step (A) in which continuous cracks are generated in a substrate formed of...

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Bibliographic Details
Main Authors MIWA TAKAO, JIBIKI SATOSHI, KOMOCHI HIROTAKA
Format Patent
LanguageEnglish
Published 22.03.2007
Subjects
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide an inorganic material working method and an inorganic material working device capable of working very fine and uniform deep grooves. SOLUTION: The inorganic material working method includes a step (A) in which continuous cracks are generated in a substrate formed of an inorganic material by irradiation with pulse laser beams so that a part of the irradiation range for each pulse overlaps each other, and a degenerated area is formed in peripheral parts of the cracks, and a step (B) of etching the degenerated area. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050255461