CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To control warp of a substrate in a multi-chip module type circuit device. SOLUTION: The circuit device 10 comprises a metal substrate 20, a multilayer wiring substrate 30, a first circuit element 40, a second circuit element 50, and a sealing resin 60. On the metal substrate 2...

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Bibliographic Details
Main Authors NISHIDA ATSUHIRO, TAKANO HIROSHI, USUI RYOSUKE
Format Patent
LanguageEnglish
Published 15.03.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To control warp of a substrate in a multi-chip module type circuit device. SOLUTION: The circuit device 10 comprises a metal substrate 20, a multilayer wiring substrate 30, a first circuit element 40, a second circuit element 50, and a sealing resin 60. On the metal substrate 20, a groove 22 with the bottom thereof reaching the multilayer wiring substrate 30 is provided between the region on which the first circuit element 40 is mounted and the region on which the second circuit element 50 is mounted. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050250349