DECORATED MOLDED ARTICLE AND MANUFACTURING METHOD THEREOF
PROBLEM TO BE SOLVED: To enable pursuit of an excellent feel of a high grade by a pattern expression of high quality and also by the depth and various lustrousnesses including a feel of bark resulting from the luster of wood grain, even when a decorated surface of a decorated molded article is a com...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
08.03.2007
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To enable pursuit of an excellent feel of a high grade by a pattern expression of high quality and also by the depth and various lustrousnesses including a feel of bark resulting from the luster of wood grain, even when a decorated surface of a decorated molded article is a complicated three-dimensional one. SOLUTION: The decorated molded article 10 is constituted by laying on an injection-molded resin piece 1 a lustrous layer 2, a transparent resin sheet 4 having an embossed pattern 3 formed on the back side, a printed pattern layer 6 and a transparent protective coating film 7, in the sequence from the injection-molded resin piece side. In a manufacturing method of the decorated molded article, (A1) an embossed sheet 5 prepared by laying the lustrous layer on the back side of the transparent resin sheet, that is, on the embossed pattern side thereof, is used as a decorated sheet and laid on the injection-molded resin piece by a simultaneous injection-molding and decorating method so as to prepare an intermediate molded article; (B) the printed pattern layer is transferred onto the surface by a hydraulic transfer method so as to prepare the intermediate molded article with a pattern; and (C) the transparent protective coating film is formed on the surface by coating. The hydraulic transfer process (B) may be omitted when the decorated sheet already having the printed pattern layer formed on the surface side is used. COPYRIGHT: (C)2007,JPO&INPIT |
---|---|
Bibliography: | Application Number: JP20050240823 |