CAPACITIVE DEVICE, ORGANIC DIELECTRIC LAMINATE, MULTILAYER STRUCTURE INCORPORATING THESE DEVICES AND METHODS OF MANUFACTURING SAME
PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented method. SOLUTION: The method for forming a multilayer structure includes: a step for preparing a dielectric composition with a permittivity ra...
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Format | Patent |
Language | English |
Published |
01.03.2007
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Abstract | PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented method. SOLUTION: The method for forming a multilayer structure includes: a step for preparing a dielectric composition with a permittivity ranging from 50 to 150 which contains paraelectrics fillers and polymers; a step for adhering the dielectric composition to a carrier film to form a multilayer film with a dielectric layer and a carrier film layer; and a step for pasting the multilayer film to a core with a circuit. It also includes: a step for facing the dielectric layer of the multilayer film layer to the core with a circuit; a step for removing the carrier film layer from the dielectric layer before processing; a step for adhering the metal layer to the dielectric layer; a step for producing a planer capacitor with the core with a circuit, dielectric layer, and metal layer; and a step for processing the planer capacitor to form a multilayer structure. COPYRIGHT: (C)2007,JPO&INPIT |
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AbstractList | PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented method. SOLUTION: The method for forming a multilayer structure includes: a step for preparing a dielectric composition with a permittivity ranging from 50 to 150 which contains paraelectrics fillers and polymers; a step for adhering the dielectric composition to a carrier film to form a multilayer film with a dielectric layer and a carrier film layer; and a step for pasting the multilayer film to a core with a circuit. It also includes: a step for facing the dielectric layer of the multilayer film layer to the core with a circuit; a step for removing the carrier film layer from the dielectric layer before processing; a step for adhering the metal layer to the dielectric layer; a step for producing a planer capacitor with the core with a circuit, dielectric layer, and metal layer; and a step for processing the planer capacitor to form a multilayer structure. COPYRIGHT: (C)2007,JPO&INPIT |
Author | COX G SIDNEY BANERJI SOUNAK DIETZ KARL HARTMANN |
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Snippet | PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | CAPACITIVE DEVICE, ORGANIC DIELECTRIC LAMINATE, MULTILAYER STRUCTURE INCORPORATING THESE DEVICES AND METHODS OF MANUFACTURING SAME |
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