CAPACITIVE DEVICE, ORGANIC DIELECTRIC LAMINATE, MULTILAYER STRUCTURE INCORPORATING THESE DEVICES AND METHODS OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented method. SOLUTION: The method for forming a multilayer structure includes: a step for preparing a dielectric composition with a permittivity ra...

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Main Authors COX G SIDNEY, BANERJI SOUNAK, DIETZ KARL HARTMANN
Format Patent
LanguageEnglish
Published 01.03.2007
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Abstract PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented method. SOLUTION: The method for forming a multilayer structure includes: a step for preparing a dielectric composition with a permittivity ranging from 50 to 150 which contains paraelectrics fillers and polymers; a step for adhering the dielectric composition to a carrier film to form a multilayer film with a dielectric layer and a carrier film layer; and a step for pasting the multilayer film to a core with a circuit. It also includes: a step for facing the dielectric layer of the multilayer film layer to the core with a circuit; a step for removing the carrier film layer from the dielectric layer before processing; a step for adhering the metal layer to the dielectric layer; a step for producing a planer capacitor with the core with a circuit, dielectric layer, and metal layer; and a step for processing the planer capacitor to form a multilayer structure. COPYRIGHT: (C)2007,JPO&INPIT
AbstractList PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented method. SOLUTION: The method for forming a multilayer structure includes: a step for preparing a dielectric composition with a permittivity ranging from 50 to 150 which contains paraelectrics fillers and polymers; a step for adhering the dielectric composition to a carrier film to form a multilayer film with a dielectric layer and a carrier film layer; and a step for pasting the multilayer film to a core with a circuit. It also includes: a step for facing the dielectric layer of the multilayer film layer to the core with a circuit; a step for removing the carrier film layer from the dielectric layer before processing; a step for adhering the metal layer to the dielectric layer; a step for producing a planer capacitor with the core with a circuit, dielectric layer, and metal layer; and a step for processing the planer capacitor to form a multilayer structure. COPYRIGHT: (C)2007,JPO&INPIT
Author COX G SIDNEY
BANERJI SOUNAK
DIETZ KARL HARTMANN
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Snippet PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Title CAPACITIVE DEVICE, ORGANIC DIELECTRIC LAMINATE, MULTILAYER STRUCTURE INCORPORATING THESE DEVICES AND METHODS OF MANUFACTURING SAME
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