CAPACITIVE DEVICE, ORGANIC DIELECTRIC LAMINATE, MULTILAYER STRUCTURE INCORPORATING THESE DEVICES AND METHODS OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented method. SOLUTION: The method for forming a multilayer structure includes: a step for preparing a dielectric composition with a permittivity ra...

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Bibliographic Details
Main Authors COX G SIDNEY, BANERJI SOUNAK, DIETZ KARL HARTMANN
Format Patent
LanguageEnglish
Published 01.03.2007
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Summary:PROBLEM TO BE SOLVED: To provide not only a method for forming a multilayer structure but also the multilayer structure itself created by using the presented method. SOLUTION: The method for forming a multilayer structure includes: a step for preparing a dielectric composition with a permittivity ranging from 50 to 150 which contains paraelectrics fillers and polymers; a step for adhering the dielectric composition to a carrier film to form a multilayer film with a dielectric layer and a carrier film layer; and a step for pasting the multilayer film to a core with a circuit. It also includes: a step for facing the dielectric layer of the multilayer film layer to the core with a circuit; a step for removing the carrier film layer from the dielectric layer before processing; a step for adhering the metal layer to the dielectric layer; a step for producing a planer capacitor with the core with a circuit, dielectric layer, and metal layer; and a step for processing the planer capacitor to form a multilayer structure. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060190735