POLYMER COMPOUND, RESIST MATERIAL AND PATTERN FORMATION METHOD

PROBLEM TO BE SOLVED: To provide a resist material excellent in transmittance to exposure light of 300 nm or shorter wavelength as well as substrate adhesion and developer dissolvability. SOLUTION: This resist material is adaptable to microfabrication technology and the base resin thereof comprises...

Full description

Saved in:
Bibliographic Details
Main Authors ENDO MASATAKA, SASAKO MASARU, UEDA MITSURU, IIMORI HIROKAZU, KISHIMURA SHINJI, FUKUHARA TOSHIAKI
Format Patent
LanguageEnglish
Published 01.03.2007
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To provide a resist material excellent in transmittance to exposure light of 300 nm or shorter wavelength as well as substrate adhesion and developer dissolvability. SOLUTION: This resist material is adaptable to microfabrication technology and the base resin thereof comprises a polymer compound containing recurring units composed of a first unit containing a sulfonamide group with same or different substituents being a hydrogen atom, a 1-20C linear, branched or cyclic alkyl group, a fluoroalkyl group or a protecting group released by an acid, and a second unit comprising a styrene derivative having on the benzene ring a fluorine atom, 1-20C linear, branched or cyclic fluorinated alkyl group or an alkoxy group with a specified substituent. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060211829