SURFACE-MOUNTING PIEZOELECTRIC DEVICE AND ITS MANUFACTURING METHOD

• Main Author: NAGANO YOJI
• Format: Patent
• Language: English
• Published: 15.02.2007
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

PROBLEM TO BE SOLVED: To use a ceramic material as a material for a package body, to obtain a package and a metal cover preventing the scattering of the splashes of a metal when the package body and the metal cover are joined, and to conduct a batch-treatment by using a sheet-shaped package-body base material having a large area in a piezoelectric device having a structure in which the upper section of the package body with a loaded part such as a piezoelectric vibrating element is covered with the metal cover and sealed airtightly. SOLUTION: The surface-mounting piezoelectric device is composed of the package body 12, and the metal cover 13 fixed under the state in which a space is surrounded containing the piezoelectric vibrating element 20 supported to the package body. The piezoelectric device has a metal layer formed along the peripheries of the top faces of package bases 15, connecting electrodes 18 being arranged to each of the top faces of the package bases so as to close each upper opening of through-holes on the inside of the package and supporting the piezoelectric vibrating element, and external electrodes 22 arranged on the undersides of the package bases. The piezoelectric device has a configuration in which the metal cover is joined with joining metal layers 17 formed along the peripheries of the top faces of the package bases, and joining surfaces form an alloy consisting of gold and tin. COPYRIGHT: (C)2007,JPO&INPIT