WATER-BASED ADHESIVE FOR USE IN RESIN-COVERED METAL AND RESIN COVERED-METAL FORMED BY USING THIS

• Main Authors: KAJIMARU HIROSHI, NAKAMURA AIKO, TAKEI GABISHI
• Format: Patent
• Language: English
• Published: 15.02.2007
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a water-based adhesive for use in resin-covered metals which has a low content of an organic solvent and is excellent in the adhesiveness between the metal and a resin and to provide a resin-covered metal which is improved in the adhesiveness, especially in the adhesiveness after the processing. SOLUTION: The water-based adhesive for use in resin-covered metals is characterized by having a polyester resin with an acid value of from 2 mg KOH/g to less than 8 mg KOH/g and an isocyanate compound dispersed in an aqueous medium. The resin-covered metal comprising a substrate metal and a covering resin which covers the metal, is characterized in that an adhesive layer comprising the above water-based adhesive for use in resin-covered metals is sandwiched in between the above covering resin and the above substrate metal. COPYRIGHT: (C)2007,JPO&INPIT