SEALING DEVICE AND METHOD USEFUL IN SEMICONDUCTOR PROCESSING APPARATUS FOR JOINING MATERIALS HAVING THERMAL EXPANSION DIFFERENCE

• Main Authors: TEPMAN AVI, DAVENPORT ROBERT E
• Format: Patent
• Language: English
• Published: 08.02.2007
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CYLINDERS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LIGHTING; MECHANICAL ENGINEERING; METALLURGY; PISTONS; SEALINGS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THERMAL INSULATION IN GENERAL; WEAPONS

PROBLEM TO BE SOLVED: To provide a device and a method for sealing, in which a seal component, capable of keeping a first portion of a semiconductor processing chamber at a first pressure while keeping a second portion of the semiconductor processing chamber at a second pressure, is applied to joining members having different thermal expansion coefficients. SOLUTION: A seal means 140 having a metal-comprising layer 202 is brazed through a braze material 204 between an upper platen 106 and an extension member 142 of a supporting platform housing 108 that have different thermal extension coefficients. COPYRIGHT: (C)2007,JPO&INPIT